This occurs too many times !!!
I suggest doing a quick re-solder by hand, (thin bit and 0.6mm solder) when the component is new to strength it up a bit.
Flow solder time/heat envelopes in China are based on the smaller components, this leaves the components with heavier pins (like USB sockets) to absorb the heat instead of remaining at the joint contact, resulting in minimal solder melt hence the dimples you see instead of a nice flowed joint.
Consequence of low costs