Just got some exciting leak info about the DJI O4 “Lite” - looks like we’re getting our first glimpse of this super compact digital system! The most impressive part? They’re saying it’ll weigh just 10g 
The Hardware
The PCB is absolutely packed - DJI has used every millimeter of space to cram everything onto a single board. It’s pretty wild to see how dense the component layout is. The camera comes with a TPU mount (looks like it’s meant for bigger frames) and rocks a really slim lens setup.
Some Interesting Details
They’ve apparently downclocked this compared to the regular O4 - probably to handle heat better since there’s no visible heatsinks on this thing. I’m really curious to see how it performs in real-world conditions.
Potential Issues to Watch For
Not gonna lie, there are a few things that make me a bit nervous:
- Those S2 and E3T chips are just sitting there exposed - they’re known to crack on impact
- Components are packed right up to the PCB edges (could be asking for trouble)
- No heatsinks visible anywhere (might get spicy!
)
Release Info
Word is we’ll see this drop on January 25th. Definitely keeping my eyes peeled for more details and real-world testing.
What do you all think about this super compact approach? Personally, I’m stoked about the weight savings, but a bit concerned about durability. Would love to hear your thoughts! 
